The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Aug. 04, 2016
Applicant:
Sumitomo Chemical Company, Limited, Tokyo, JP;
Inventors:
Assignee:
SUMITOMO CHEMICAL COMPANY, LIMITED, Chuo-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); H01L 51/50 (2006.01); H05B 33/04 (2006.01); H05B 33/10 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); H01L 51/0097 (2013.01); H01L 51/50 (2013.01); H01L 51/5206 (2013.01); H01L 51/5221 (2013.01); H01L 51/5246 (2013.01); H01L 51/5259 (2013.01); H05B 33/04 (2013.01); H05B 33/10 (2013.01);
Abstract
According to a method for manufacturing an organic electronic device, a sealing member () that includes a sealing substrate (), an adhesive part () exhibiting adhesiveness and is provided on the sealing substrate (), and a hygroscopic part () being a hygroscopic cured product provided on the adhesive part () is bonded to an organic electronic element ().