The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Dec. 06, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventor:
Eui-bok Lee, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/78 (2006.01); H01L 21/768 (2006.01); H01L 23/485 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4232 (2013.01); H01L 21/76805 (2013.01); H01L 21/76849 (2013.01); H01L 23/481 (2013.01); H01L 23/485 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 29/4238 (2013.01); H01L 29/785 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01);
Abstract
A semiconductor device has a high electric connection reliability and includes a base substrate having a connection target layer, a lower contact plug formed over the base substrate and electrically connected to the connection target layer, and an upper contact plug formed over the lower contact plug, wherein the lower contact plug includes a lower plug layer having a gap portion extending inward from a top portion of the lower plug layer, a gap cover layer filling the gap portion, and an upper cover layer covering a top surface of the lower plug layer.