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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10403650 B1

PDFFull Text
Date of Patent:
Sep. 03, 2019

Filed:

May. 08, 2018

Electronic device and manufacturing method thereof

Applicant:

Gio Optoelectronics Corp., Tainan, TW;

Inventor:

Wu-Chang Yang, Tainan, TW;

Assignee:

GIO OPTOELECTRONICS CORP., Tainan, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Mamadou L Diallo

Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 51/00 (2006.01); H01L 27/30 (2006.01); H01L 27/32 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 21/3213 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/167 (2013.01); H01L 27/127 (2013.01); H01L 27/1218 (2013.01); H01L 27/1266 (2013.01); H01L 27/307 (2013.01); H01L 27/3276 (2013.01); H01L 51/0097 (2013.01); H01L 21/32133 (2013.01); H01L 33/62 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/81005 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/13069 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of an electronic device includes following steps: forming a flexible substrate on a rigid carrier plate; forming at least a thin-film device on the flexible substrate; forming a conductive line on the flexible substrate, wherein the conductive line is electrically connected with the thin-film device; forming at least an electrical connection pad on the flexible substrate, wherein the electrical connection pad is electrically connected with the conductive line, and the thickness of the electrical connection pad is between 2 and 20 microns; disposing at least a surface-mount device (SMD) on the flexible substrate, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line; and removing the rigid carrier plate.

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