The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10403595 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 03, 2019

Filed:

Jun. 07, 2017
Applicant:

Joel T. Harrison, Henrico, VA (US);

Inventor:

Joel T. Harrison, Henrico, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/00 (2006.01); H01L 23/00 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/799 (2013.01); H01L 24/98 (2013.01); H01L 2224/7999 (2013.01); H01L 2224/98 (2013.01);
Abstract

An assembly is provided for mechanically severing ball grid array (BGA) attachment solder between an electronics chip and a printed circuit board. The assembly includes a bridge fixture, a tungsten wire and removable spacers. The bridge fixture extends over the chip. A pair of guide bars flanks the bridge fixture. each guide bar has a wire engagement surface. The tungsten wire is disposed across the chip between the pair of guide bars along their respective surfaces. The removable spacers are disposed between the corresponding guide bars and the printed circuit board for aligning the wire to engage the solder.


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