The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Apr. 05, 2018
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Masaru Sato, Isehara, JP;

Yukiyasu Furukawa, Akiruno, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01L 23/049 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/486 (2013.01); H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4875 (2013.01); H01L 23/049 (2013.01); H01L 23/492 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01);
Abstract

A radio frequency circuit includes, a multilayer substrate having a grounded base metal and a plurality of insulating layers and wiring layers formed over the grounded base metal and having a recess surrounded by the plurality of insulating layers and wiring layers over the grounded base metal, an upper substrate having a through-hole penetrating the upper substrate, a first semiconductor chip mounted on the upper surface of the upper substrate and electrically coupled to a metal film formed on the lower surface of the upper substrate, a metal pillar formed on the upper surface of the grounded base metal in the recess, and a solder buried in the through-hole and bonded to the metal film and the upper surface of the metal pillar. The metal film is bonded to a ground wiring layer electrically coupled to the grounded base metal among the plurality of wiring layers.


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