The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Apr. 02, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yong Ho Baek, Suwon-Si, KR;
Joo Hwan Jung, Suwon-Si, KR;
Yoo Rim Cha, Suwon-Si, KR;
Young Sik Hur, Suwon-Si, KR;
Jung Chul Gong, Suwon-Si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package module includes: a structure including a wiring member including wiring patterns, one or more first passive components disposed on the wiring member and electrically connected to the wiring pattern, and a first encapsulant encapsulating at least portions of each of the one or more first passive components, and having a first through-hole penetrating through the wiring member and the first encapsulant; a semiconductor chip disposed in the first through-hole of the structure and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; a second encapsulant encapsulating at least portions of the semiconductor chip and filling at least portions of the first through-hole; and a connection member disposed on the structure and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads and the wiring patterns.