The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Nov. 23, 2015
Applicant:
Element Six Technologies Limited, Oxfordshire, GB;
Inventors:
Julian Anaya Calvo, Bristol, GB;
Martin Hermann Hans Kuball, Bristol, GB;
Julian James Sargood Ellis, Oxfordshire, GB;
Daniel James Twitchen, Oxfordshire, GB;
Assignee:
ELEMENT SIX TECHNOLOGIES LTD, , GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); C04B 37/00 (2006.01); C09K 5/14 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3732 (2013.01); C04B 37/006 (2013.01); C09K 5/14 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01); C04B 2235/722 (2013.01); C04B 2235/963 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/12 (2013.01); C04B 2237/122 (2013.01); C04B 2237/125 (2013.01); C04B 2237/363 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device comprising:
Anaya Calvo, Julian. (2019). Bonding scheme for diamond components which has low thermal barrier resistance in high power density applications (U.S. Patent No. 10403557). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10403557
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile