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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10403513 B1

PDFFull Text
Date of Patent:
Sep. 03, 2019

Filed:

Feb. 20, 2018

Manufacturing method of semiconductor device and semiconductor device

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Shoji Hashizume, Takasaki, JP;

Keita Takada, Tokyo, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Tokyo, JP;

Attorney:

McGinn IP Law Group, PLLC.

Primary Examiner:

Hrayr A Sayadian

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/544 (2006.01); B29C 45/14 (2006.01); B29C 45/00 (2006.01); H01L 23/31 (2006.01); B29L 31/34 (2006.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 45/0025 (2013.01); B29C 45/0046 (2013.01); B29C 45/14336 (2013.01); B29C 45/14655 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/544 (2013.01); B29C 2045/0027 (2013.01); B29L 2031/34 (2013.01); H01L 2223/54433 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H02P 27/06 (2013.01);
Abstract

In a manufacturing method of a semiconductor device, by arranging a lead in the vicinity of a gate portion serving as a resin injection port of a mold, a void is prevented from remaining within an encapsulation body when two semiconductor chips arranged so as to overlap in the Y direction are encapsulated with resin. Further, a length of an inner lead portion of the lead in the Y direction is greater than a length of an inner lead portion of another lead overlapping a chip mounting portion in the Y direction.

Find Patent Forward Citations

Hashizume, Shoji. (2019). Manufacturing method of semiconductor device and semiconductor device (U.S. Patent No. 10403513). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10403513

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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