The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Feb. 20, 2018
Applicant:
Renesas Electronics Corporation, Tokyo, JP;
Inventors:
Shoji Hashizume, Takasaki, JP;
Keita Takada, Tokyo, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/544 (2006.01); B29C 45/14 (2006.01); B29C 45/00 (2006.01); H01L 23/31 (2006.01); B29L 31/34 (2006.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 45/0025 (2013.01); B29C 45/0046 (2013.01); B29C 45/14336 (2013.01); B29C 45/14655 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/544 (2013.01); B29C 2045/0027 (2013.01); B29L 2031/34 (2013.01); H01L 2223/54433 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H02P 27/06 (2013.01);
Abstract
In a manufacturing method of a semiconductor device, by arranging a lead in the vicinity of a gate portion serving as a resin injection port of a mold, a void is prevented from remaining within an encapsulation body when two semiconductor chips arranged so as to overlap in the Y direction are encapsulated with resin. Further, a length of an inner lead portion of the lead in the Y direction is greater than a length of an inner lead portion of another lead overlapping a chip mounting portion in the Y direction.