The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Aug. 12, 2015
Applicant:

Shindengen Electric Manufacturing Co., Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Yusuke Fukuda, Saitama, JP;

Yoshiyuki Watanabe, Saitama, JP;

Shunichi Nakamura, Saitama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/268 (2006.01); H01L 29/45 (2006.01); H01L 29/34 (2006.01); H01L 29/16 (2006.01); H01L 21/28 (2006.01); H01L 21/302 (2006.01); H01L 29/872 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/861 (2006.01); H01L 29/868 (2006.01); H01L 21/04 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02529 (2013.01); H01L 21/02183 (2013.01); H01L 21/02186 (2013.01); H01L 21/0485 (2013.01); H01L 21/28 (2013.01); H01L 21/302 (2013.01); H01L 29/0657 (2013.01); H01L 29/1608 (2013.01); H01L 29/34 (2013.01); H01L 29/45 (2013.01); H01L 29/6606 (2013.01); H01L 29/66068 (2013.01); H01L 29/66712 (2013.01); H01L 29/868 (2013.01); H01L 29/8611 (2013.01); H01L 29/872 (2013.01); H01L 21/268 (2013.01); H01L 29/0615 (2013.01); H01L 29/7802 (2013.01);
Abstract

A method of manufacturing a silicon carbide semiconductor device includes, in order: polishing a silicon carbide semiconductor base body from a second main surface side thus forming unevenness on a second main surface; forming a thin metal film made of metal capable of forming a metal carbide on the second main surface of the silicon carbide semiconductor base body; irradiating a laser beam which falls within a visible region or within an infrared region to the thin metal film so as to heat the thin metal film thus forming a metal carbide on a boundary face between the silicon carbide semiconductor base body and the thin metal film; etching a metal containing byproduct layer possibly formed on a surface side of the metal carbide by a non-oxidizing chemical solution thus exposing a surface of the metal carbide; and forming a cathode electrode on the metal carbide.


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