The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Jun. 20, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;

Inventors:

Yong Gyu Chu, Seoul, KR;

Hyo Soon Kang, Seoul, KR;

Seung Bum Ko, Hwaseong-si, KR;

Sang Jae Rhee, Seongnam-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); H01L 21/50 (2006.01); H01L 23/48 (2006.01); H01L 23/50 (2006.01); G11C 7/22 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
G11C 7/10 (2013.01); G11C 7/1012 (2013.01); G11C 7/1045 (2013.01); G11C 7/22 (2013.01); H01L 21/50 (2013.01); H01L 23/48 (2013.01); H01L 23/50 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); G11C 2207/105 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/0651 (2013.01); H01L 2924/1434 (2013.01);
Abstract

A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.


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