The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
May. 16, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Byung Ho Kim, Suwon-Si, KR;
Da Hee Kim, Suwon-Si, KR;
Joon Sung Kim, Suwon-Si, KR;
Joo Young Choi, Suwon-Si, KR;
Hee Sook Park, Suwon-Si, KR;
Tae Wook Kim, Suwon-Si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package includes: a core member including a support layer, a first wiring layer, a second wiring layer, and through-vias and having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant covering the core member and the semiconductor chip and filling at least portions of the through-hole; a connection member including an insulating layer disposed on the first wiring layer and the semiconductor chip, a redistribution layer disposed on the insulating layer, first vias electrically connecting the redistribution layer and the connection pads to each other, and second vias electrically connecting the redistribution layer and the first wiring layer to each other; and a passivation layer disposed on the insulating layer and covering the redistribution layer, wherein a thickness of the passivation layer is within half a distance from an inactive surface of the semiconductor chip to a lower surface of the encapsulant.