The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
May. 20, 2016
Applicant:
Ciena Corporation, Hanover, MD (US);
Inventors:
Robert Bisson, Kanata, CA;
Marko Antonic, Kanata, CA;
Assignee:
Ciena Corporation, Hanover, MD (US);
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5077 (2013.01); H05K 1/0245 (2013.01); H05K 3/0005 (2013.01); H05K 1/024 (2013.01); H05K 1/0248 (2013.01); H05K 1/0298 (2013.01); H05K 1/0366 (2013.01); H05K 1/182 (2013.01); H05K 2201/029 (2013.01); H05K 2201/044 (2013.01);
Abstract
A method of manufacturing a printed circuit board (PCB) includes determining a weft direction of the PCB, and defining a routing design of differential pairs. The routing design is designed to have a fixed region in the weft direction. The method further includes manufacturing the PCB according to the routing design.
Bisson, Robert. (2019). Spread weave induced skew minimization (U.S. Patent No. 10402531). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10402531
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile