The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Mar. 23, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jong In Kim, Seoul, KR;

Ho Young Song, Suwon-si, KR;

Yong Il Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); F21V 8/00 (2006.01); F21Y 101/00 (2016.01);
U.S. Cl.
CPC ...
G02B 6/0073 (2013.01); H01L 33/46 (2013.01); H01L 33/56 (2013.01); F21Y 2101/00 (2013.01); H01L 33/508 (2013.01); H01L 33/62 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A semiconductor light emitting device includes a wiring board including a mounting surface on which a first wiring electrode and a second wiring electrode are disposed; a semiconductor light emitting diode (LED) chip including a first surface on which a first electrode and a second electrode are disposed, the first surface facing the mounting surface, the semiconductor LED chip further including a second surface positioned opposite to the first surface, and side surfaces positioned between the first and second surfaces, the first and second electrodes being connected to the first and second wiring electrodes, respectively; and a reflective layer disposed on at least one of the second surface and the side surfaces of the semiconductor LED chip.


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