The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Jun. 30, 2017
Applicant:

Technoprobe S.p.a., Cernusco Lombardone, IT;

Inventor:

Raffaele Ubaldo Vallauri, Cernusco Lombardone, IT;

Assignee:

TECHNOPROBE S.P.A., Cernusco Lombardone, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 1/04 (2006.01); G01R 3/00 (2006.01); B23K 26/38 (2014.01); B44C 1/22 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06744 (2013.01); B23K 26/38 (2013.01); B44C 1/22 (2013.01); G01R 1/0408 (2013.01); G01R 1/0433 (2013.01); G01R 1/07307 (2013.01); G01R 1/07314 (2013.01); G01R 1/07342 (2013.01); G01R 1/07364 (2013.01); G01R 3/00 (2013.01); B23K 2101/38 (2018.08); G01R 1/07371 (2013.01);
Abstract

A manufacturing method of contact probes for a testing head comprises the steps of: providing a substrate made of a conductive material; and defining at least one contact probe by laser cutting the substrate. The method further includes at least one post-processing fine definition step of at least one end portion of the contact probe, that follows the step of defining the contact probe by laser cutting, the end portion being a portion including a contact tip or a contact head of the contact probe. The fine definition step does not involve a laser processing and includes geometrically defining the end portion of the contact probe with at least a substantially micrometric precision.


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