The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Mar. 12, 2014
Constantia Teich Gmbh, Weinburg, AT;
Research Center for Non Destructive Testing Gmbh, Linz, AT;
Bernhard Reitinger, Alkoven, AT;
Saeid Zamiri, Linz, AT;
Clemens Gruensteidl, Linz, AT;
Juergen Roither, Grieskirchen, AT;
Martin Kornfeld, Klosterneuburg, AT;
Alfred Wegenberger, Langenlois, AT;
CONSTANTIA TEICH GMBH, Weinburg, AT;
Abstract
For a simple, fast, safe and reliable determination of the layer thickness of a bonding layer between two layers of a packaging, a laser ultrasonic method is provided, in which the transit time of the ultrasonic wave through the first and second packaging layers () is determined in advance, and a maximum (M, M, M) in the measurement signal (S) is sought, and the point in time of occurrence of this maximum (M, M, M) is determined as the total transit time (T, T, T) of the ultrasonic wave, and the transit time of the ultrasonic wave through the first and second packaging layers () is subtracted from the total transit time (T, T, T), and the thickness (d) of the bonding layer is deduced from the known ultrasonic speed (v) in the bonding layer ().