The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

May. 12, 2016
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Jaepyo Hong, Seoul, KR;

Jaechan Kim, Seoul, KR;

Injoong Kim, Seoul, KR;

Hyeuk Chang, Seoul, KR;

Sumin Jun, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); F21V 29/74 (2015.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H05K 1/05 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
F21V 29/74 (2015.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 33/642 (2013.01); H05K 1/053 (2013.01); H05K 3/38 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1355 (2013.01);
Abstract

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer to enable electric current to flow therein. The conductive layer includes an electrically conductive layer providing a path region in which electric current is applied to the light source, and a heat dissipation conductive layer diffusing generated by the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.


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