The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Aug. 05, 2016
Applicant:
Nippon Light Metal Company, Ltd., Tokyo, JP;
Inventors:
Assignee:
NIPPON LIGHT METAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/00 (2006.01); C25D 3/12 (2006.01); C25D 5/16 (2006.01); C25D 7/00 (2006.01); H01R 13/03 (2006.01); H01R 43/16 (2006.01); H01R 4/58 (2006.01); H01R 4/70 (2006.01);
U.S. Cl.
CPC ...
C25D 3/12 (2013.01); C25D 5/16 (2013.01); C25D 7/00 (2013.01); H01R 4/58 (2013.01); H01R 13/03 (2013.01); H01R 43/16 (2013.01); H01R 4/70 (2013.01);
Abstract
To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. To solve the problem by providing a conductive member having a Ni plating layeron the surface of contact partsprovided on a substrate, an arithmetic average roughness Sa of the surface of the Ni plating layerbeing 20 nm or more. In the Ni plating layer, the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness Hof the Ni plating layeris preferably 5000 n/mmor less.