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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10400311 B1

PDFFull Text
Date of Patent:
Sep. 03, 2019

Filed:

Jan. 15, 2016

Wrought material comprising cu—al—mn-based alloy excellent in stress corrosion resistance and use thereof

Applicants:

Furukawa Techno Material Co., Ltd., Hiratsuka-shi, Kanagawa, JP;

Furukawa Electric Co., Ltd., Tokyo, JP;

Tohoku University, Sendai-shi, Miyagi, JP;

Inventors:

Sumio Kise, Hiratsuka, JP;

Toyonobu Tanaka, Hiratsuka, JP;

Kenji Nakamizo, Hiratsuka, JP;

Koji Ishikawa, Hiratsuka, JP;

Misato Fujii, Hiratsuka, JP;

Toshihiro Omori, Sendai, JP;

Ryosuke Kainuma, Sendai, JP;

Assignees:

FURUKAWA TECHNO MATERIAL CO., LTD., Hiratsuka-Shi, Kanagawa, JP;

FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;

TOHOKU UNIVERSITY, Sendai-Shi, Miyagi, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Dawayne Pinkney

Int. Cl.
CPC ...
G02C 5/00 (2006.01); G02C 5/08 (2006.01); G02C 1/00 (2006.01); G02C 1/08 (2006.01); G02C 1/04 (2006.01); G02C 1/02 (2006.01); C22C 9/01 (2006.01); C22C 9/05 (2006.01); C22F 1/08 (2006.01); A61C 7/20 (2006.01); A61L 31/02 (2006.01); A61L 31/14 (2006.01); A61F 5/01 (2006.01); A61F 5/11 (2006.01);
U.S. Cl.
CPC ...
C22C 9/01 (2013.01); A61C 7/20 (2013.01); A61F 5/019 (2013.01); A61F 5/11 (2013.01); A61L 31/022 (2013.01); A61L 31/14 (2013.01); C22C 9/05 (2013.01); C22F 1/08 (2013.01); G02C 5/008 (2013.01); A61C 2201/007 (2013.01);
Abstract

A wrought material containing a Cu—Al—Mn-based alloy, in which an existence frequency of a coincidence grain boundary with a Σ value of 3 or less is 35% or more but 75% or less, and which has a recrystallized microstructure substantially formed from a β single phase; and the use thereof.

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