The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Jan. 29, 2019
Applicant:

Hitachi Metals, Ltd., Minato-ku, Tokyo, JP;

Inventors:

Tsuyoshi Miura, Tokyo, JP;

Tamotsu Kibe, Tokyo, JP;

Makoto Iwasaki, Tokyo, JP;

Yoshiaki Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/295 (2006.01); C09K 21/14 (2006.01); H01B 3/30 (2006.01);
U.S. Cl.
CPC ...
C09K 21/14 (2013.01); H01B 3/30 (2013.01); H01B 7/295 (2013.01); C08L 2201/02 (2013.01); C08L 2203/202 (2013.01);
Abstract

In a multi-layer insulated wire including: a conductor; an inner layer formed in periphery of the conductor; and an outer layer formed in periphery of the inner layer, the inner layer is made of a resin composition containing a base polymer containing polyolefin as a main component, and the outer layer is made of a resin composition containing a base polymer containing polyolefin as a main component so as to contain 80 or more and 250 or less parts by mass of metallic hydroxide per 100 parts by mass of the base polymer. The multi-layer insulated wire having an expansion start temperature of the outer layer that is equal to or lower than 344° C. is used.


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