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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10399312 B1

PDFFull Text
Date of Patent:
Sep. 03, 2019

Filed:

Nov. 08, 2016

Oxazine compound, composition and cured product

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Masato Otsu, Sakura, JP;

Tomohiro Shimono, Sakura, JP;

Kazuo Arita, Sakura, JP;

Junji Yamaguchi, Sakura, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Guillermo J Egoavil

Int. Cl.
CPC ...
C07D 265/16 (2006.01); C08F 2/44 (2006.01); C08F 216/12 (2006.01); C08G 14/073 (2006.01); H05K 1/03 (2006.01); H01L 23/14 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); B32B 27/42 (2006.01); C08L 61/34 (2006.01); C08L 39/00 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); C08K 7/02 (2006.01);
U.S. Cl.
CPC ...
B32B 27/42 (2013.01); C07D 265/16 (2013.01); C08L 39/00 (2013.01); C08L 61/34 (2013.01); H01L 23/14 (2013.01); H01L 23/293 (2013.01); H01L 23/31 (2013.01); H01L 23/3737 (2013.01); H01L 24/26 (2013.01); H05K 1/0346 (2013.01); B32B 2457/08 (2013.01); C08K 7/02 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01);
Abstract

The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.

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