The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Jul. 21, 2016
Applicants:

Sumitomo Chemical Company, Limited, Tokyo, JP;

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Mitsunori Nodono, Tsukuba, JP;

Takashi Sakurai, Tsukuba, JP;

Katsunori Mochizuki, Osaka, JP;

Junichi Ikeuchi, Tsukuba, JP;

Boram Pyeon, Tsukuba, JP;

Tzong Ming Lee, Chutung Hsinchu, TW;

Chyi Ming Leu, Chutung Hsinchu, TW;

Chih Cheng Lin, Chutung Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/34 (2006.01); C08J 5/18 (2006.01); G02B 1/04 (2006.01); C08L 79/08 (2006.01); G02F 1/1337 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
B32B 27/34 (2013.01); C08J 5/18 (2013.01); C08L 79/08 (2013.01); G02B 1/04 (2013.01); G02F 1/1337 (2013.01); H01L 27/323 (2013.01); H01L 51/0096 (2013.01); H01L 51/524 (2013.01); B32B 2307/7242 (2013.01); C08J 2379/08 (2013.01); G06F 3/041 (2013.01); G06F 2203/04102 (2013.01); H01L 2251/5369 (2013.01); Y02E 10/50 (2013.01);
Abstract

A resin filmcomprising a polyimide-based polymer is disclosed. The resin filmhas a tensile elastic modulus of 4.0 GPa or more. In a bending test where the resin filmis repeatedly folded into a U-shape until the distance between the resin film faces opposed to each other reaches 3 mm, and unfolded, the number of times of folding the resin filmuntil the resin filmfractures is more than 100000.


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