The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Dec. 31, 2015
Applicant:
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Inventors:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/00 (2006.01); B29C 33/42 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01); B29C 33/38 (2006.01); C23C 14/34 (2006.01); B29C 33/56 (2006.01); B41C 1/05 (2006.01);
U.S. Cl.
CPC ...
B29C 33/424 (2013.01); B29C 33/3842 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); C23C 14/3407 (2013.01); G03F 7/0002 (2013.01); B29C 33/56 (2013.01); B29K 2833/04 (2013.01); B29K 2905/00 (2013.01); B41C 1/05 (2013.01); H01J 2237/281 (2013.01);
Abstract
A seamless mold manufacturing method of the invention is a seamless mold manufacturing method having the steps of forming a thermal reaction type resist layer on a sleeve-shaped mold, and exposing using a laser and developing the thermal reaction type resist layer and thereby forming a fine mold pattern, and is characterized in that the thermal reaction type resist layer is comprised of a thermal reaction type resist having a property of reacting in predetermined light intensity or more in a light intensity distribution in a spot diameter of the laser.