The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Aug. 29, 2013
Applicant:
Dow Global Technologies Llc, Midland, MI (US);
Inventors:
Demei Xie, Hunan, CN;
Liangkai Ma, Midland, MI (US);
Assignee:
Dow Global Technologies LLC, Midland, MI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/40 (2006.01); B29C 70/54 (2006.01); B29C 35/02 (2006.01); B29C 33/02 (2006.01); B29C 33/38 (2006.01); B29K 101/10 (2006.01);
U.S. Cl.
CPC ...
B29C 33/405 (2013.01); B29C 33/02 (2013.01); B29C 33/3828 (2013.01); B29C 33/3842 (2013.01); B29C 35/02 (2013.01); B29C 70/54 (2013.01); B29C 2033/385 (2013.01); B29K 2101/10 (2013.01); B29K 2905/00 (2013.01); B29K 2913/00 (2013.01); B29K 2995/0013 (2013.01);
Abstract
A multi-layered composite mold structure () is provided. The multi-layered composite mold structure () comprises a multi-layered member including (a) at least one metal heating layer (); (b) at least one metal heat distribution layer (); (c) at least one laminate composite layer (); and (d) a surface layer (). A process for preparing the multi-layered composite mold structure is also provided.