The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Aug. 08, 2014
Applicant:

Dell Products, L.p., Round Rock, TX (US);

Inventors:

Travis C. North, Cedar Park, TX (US);

Austin Michael Shelnutt, Leander, TX (US);

Chris Helberg, Austin, TX (US);

Rene Jason Salas, Round Rock, TX (US);

Assignee:

Dell Products, L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01); B23P 15/26 (2006.01);
U.S. Cl.
CPC ...
B23P 15/26 (2013.01); G06F 1/20 (2013.01); H01L 23/427 (2013.01); G06F 2200/201 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An assembly for cooling a heat dissipating device reducing the thermal contact/interface resistance between a heatsink and a heat dissipating device includes: a heat dissipating device having a heat releasing surface; a heatsink having a heat absorbing surface; a gasket extending between the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity; and a working fluid provided within the cavity. The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor at the liquid surface in contact with the heat releasing surface during operation of the heat dissipating device and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink.


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