The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Mar. 28, 2016
Applicant:

Rofin-sinar Technologies Inc., Plymouth, MI (US);

Inventors:

S Abbas Hosseini, Los Altos, CA (US);

Peter R. Herman, Toronto, CA;

Assignee:

ROFIN-SINAR TECHNOLOGIES LLC, Plymouth, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/06 (2014.01); B26F 3/00 (2006.01); H01L 21/263 (2006.01); C03B 33/02 (2006.01); B23K 26/00 (2014.01); B23K 26/0622 (2014.01); B23K 26/08 (2014.01); C03C 23/00 (2006.01); B23K 103/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/0006 (2013.01); B23K 26/0604 (2013.01); B23K 26/0619 (2015.10); B23K 26/0622 (2015.10); B23K 26/0624 (2015.10); B23K 26/083 (2013.01); B26F 3/00 (2013.01); C03B 33/0222 (2013.01); C03C 23/0025 (2013.01); H01L 21/2633 (2013.01); B23K 2103/42 (2018.08); B23K 2103/50 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); H01L 21/78 (2013.01); Y10T 225/12 (2015.04);
Abstract

A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving said substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation and increasing the filament length.


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