The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Feb. 20, 2013
Applicant:
Smith & Nephew, Inc., Memphis, TN (US);
Inventors:
Marcus L Scott, Ft Worth, TX (US);
Lu Gan, Toronto, CA;
Vivek D Pawar, Germantown, TN (US);
Stanley Tsai, Portland, OR (US);
Assignee:
Smith & Nephew, Inc., Memphis, TN (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/11 (2006.01); B22F 3/105 (2006.01); B22F 3/24 (2006.01); B29C 65/00 (2006.01); A61L 27/56 (2006.01); A61L 27/04 (2006.01); B33Y 40/00 (2015.01); C22F 1/18 (2006.01); B29C 64/153 (2017.01); B33Y 80/00 (2015.01); B33Y 70/00 (2015.01); B29K 101/00 (2006.01); B29K 105/04 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1146 (2013.01); A61L 27/04 (2013.01); A61L 27/56 (2013.01); B22F 3/105 (2013.01); B22F 3/1055 (2013.01); B22F 3/24 (2013.01); B29C 64/153 (2017.08); B29C 66/72 (2013.01); B33Y 40/00 (2014.12); C22F 1/18 (2013.01); B22F 2003/248 (2013.01); B29K 2101/00 (2013.01); B29K 2105/04 (2013.01); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C04B 2235/6026 (2013.01); C04B 2235/6584 (2013.01); C04B 2235/665 (2013.01); Y02P 10/295 (2015.11);
Abstract
The present disclosure provides methods to improve the properties of a porous structure formed by a rapid manufacturing technique. Embodiments of the present disclosure increase the bonding between the micro-particleson the surface of the porous structure and the porous structure itself without substantially reduce the surface area of the micro-particles. In one aspect, embodiments of the present disclosure improves the bonding while preserving or increasing the friction of the structure against adjacent materials.