The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Aug. 06, 2018
Applicant:
David Lane Smith, Montgomery, TX (US);
Inventor:
David Lane Smith, Montgomery, TX (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/44 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01); H05K 5/00 (2006.01); H01L 23/473 (2006.01); H01L 23/427 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20809 (2013.01); G06F 1/20 (2013.01); H01L 23/427 (2013.01); H01L 23/44 (2013.01); H01L 23/473 (2013.01); H05K 5/0017 (2013.01); H05K 7/203 (2013.01); H05K 7/20236 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); H05K 7/20681 (2013.01); H05K 5/0247 (2013.01); H05K 7/20381 (2013.01);
Abstract
A system and method for cooling electronic devices disposed within the inner volume of an enclosure. The inner volume of the enclosure contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that displace and direct thermally conductive fluids.
Smith, David. (2019). System and method for fluid cooling of electronic devices installed in an enclosure (U.S. Patent No. 10398063). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10398063
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile