The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Sep. 13, 2018
Applicants:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Hitachi Chemical Company, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Akihito Goto, Nagoya, JP;

Masahiro Sakata, Nisshin, JP;

Masaki Yamaguchi, Tsukuba, JP;

Assignees:

TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, Aichi-ken, JP;

Hitachi Chemical Company, Ltd., Chiyoda-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/095 (2013.01); H05K 1/115 (2013.01); H05K 3/4069 (2013.01); H05K 3/4614 (2013.01); H05K 3/4647 (2013.01); H05K 3/4652 (2013.01);
Abstract

A laminated substrate includes: a first substrate; a second substrate having a through-hole; a third substrate; a first adhesive layer bonding a rear surface of the first substrate and a front surface of the second substrate; a second adhesive layer bonding a rear surface of the second substrate and a front surface of the third substrate; a first post penetrating through the first adhesive layer, electrically connecting the first substrate to the second substrate, and made of an alloy of a high melting point metal and a low melting point metal; a second post penetrating through the second adhesive layer, electrically connecting the second substrate to the third substrate, and made of an alloy of the high melting point metal and the low melting point metal; and an electronic component fixed to the front surface of the third substrate and disposed in the through-hole of the second substrate.


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