The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

May. 24, 2016
Applicant:

Goertek Inc., Weifang, Shandong, CN;

Inventors:

Guodong Zhao, Weifang, CN;

Pengcheng Ji, Weifang, CN;

Xinfeng Yang, Weifang, CN;

Assignee:

GOERTEK INC., Weifang, Shandong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 7/06 (2006.01); H04R 31/00 (2006.01); H04R 3/00 (2006.01); H04R 7/16 (2006.01); H04R 7/18 (2006.01); H04R 9/06 (2006.01);
U.S. Cl.
CPC ...
H04R 31/003 (2013.01); H04R 3/002 (2013.01); H04R 7/06 (2013.01); H04R 7/16 (2013.01); H04R 7/18 (2013.01); H04R 31/00 (2013.01); H04R 9/06 (2013.01); H04R 2207/021 (2013.01); H04R 2231/001 (2013.01);
Abstract

A vibration diaphragm and a manufacturing method thereof are provided. The vibration diaphragm comprises an annular support member, a first vibration diaphragm layer and a circuit layer. The first vibration diaphragm layer is fixedly connected to a support body of the annular support member. The circuit layer is positioned on a surface of the first vibration diaphragm layer that is adjacent to a vibrating voice coil and is fixedly connected to the first vibration diaphragm layer and the support body. The circuit layer is provided with a circuit area, a capacitance area, and a capacitance solder pad. The capacitance area is a capacitance electrode plate formed on the first vibration diaphragm layer. The capacitance area is communicated with the capacitance solder pad by means of the circuit area. The solder pad corresponds to the support body. The reliability of capacitance data acquisition is improved.


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