The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Nov. 14, 2018
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Ikuhei Kimura, Nagaokakyo, JP;
Nobuo Ikemoto, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 9/16 (2006.01); H01Q 1/50 (2006.01); H01Q 9/06 (2006.01); G06K 19/077 (2006.01); H04W 4/80 (2018.01);
U.S. Cl.
CPC ...
H01Q 1/2225 (2013.01); G06K 19/07773 (2013.01); G06K 19/07783 (2013.01); G06K 19/07784 (2013.01); G06K 19/07786 (2013.01); G06K 19/07794 (2013.01); H01Q 1/38 (2013.01); H01Q 1/50 (2013.01); H01Q 9/065 (2013.01); H01Q 9/16 (2013.01); H04W 4/80 (2018.02);
Abstract
A compact wireless communication includes a first radiating element and a second radiating element, which define and function as a dipole antenna, a feeder circuit including a wireless IC chip coupled with the first and second radiating elements, and a feeder substrate that is provided with the wireless IC chip. The first radiating element is provided to the feeder substrate. The second radiating element is provided to a substrate other than the feeder substrate.