The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
May. 21, 2013
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Koichi Miyake, Saitama, JP;
Tomoyuki Maeda, Saitama, JP;
Kazutaka Hozumi, Saitama, JP;
Hiroaki Nakahara, Saitama, JP;
Shinichi Yamauchi, Saitama, JP;
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Abstract
An object of the present invention is to provide a copper foil inexpensive and sufficient in tensile strength even after heat treatment. The copper foil includes zinc in a content range of 0.02% by mass to 2.7% by mass in the total mass of the entire copper foil, and if the regions in thicknesses direction from both surfaces of the copper foil where occupies 5% by mass in the total mass of the entire copper foil are referred to as the respective external layers and a region between one external layer and the other external layer is referred to as an internal layer, the internal layer includes copper as a main element and includes 100 ppm or more of one or mixture of small amount-elements selected from carbon, sulfur, chlorine and nitrogen, and includes zinc at 10% or more in the total mass of zinc included in the entire copper foil.