The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Mar. 25, 2016
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Makoto Amano, Tokyo, JP;
Rikiya Yamashita, Tokyo, JP;
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/02 (2006.01); B32B 15/08 (2006.01); B29C 55/12 (2006.01); B32B 7/12 (2006.01); C08J 5/18 (2006.01); C08K 5/20 (2006.01); C08L 77/00 (2006.01); B29L 31/00 (2006.01); B29K 77/00 (2006.01); B29C 55/00 (2006.01);
U.S. Cl.
CPC ...
H01M 2/0287 (2013.01); B29C 55/12 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); H01M 2/0275 (2013.01); H01M 2/0277 (2013.01); H01M 2/0292 (2013.01); B29C 55/005 (2013.01); B29K 2077/00 (2013.01); B29L 2031/7146 (2013.01); B32B 2255/06 (2013.01); B32B 2255/10 (2013.01); C08J 5/18 (2013.01); C08K 5/20 (2013.01); C08L 77/00 (2013.01);
Abstract
A cell packaging material in which the substrate layer surface has excellent ink printing characteristics. Cell packaging material including a layered article provided with at least a substrate layer, a metal layer, and a heast-fusible layer in the stated order, the substrate layer being formed from a polyamide resin containing an ethylene-bis-stearic acid amide and an ethylene-bis-oleic acid amide.