The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Aug. 03, 2016
Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, Jiangsu Province, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Wen Lee, Shiyan, CN;

Ju-Shan Lu, Changzhou, CN;

Shu-Yong Jia, Changzhou, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 2/00 (2006.01); F21V 19/00 (2006.01); H01L 33/50 (2010.01); F21Y 113/13 (2016.01); F21Y 115/10 (2016.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/504 (2013.01); F21K 2/00 (2013.01); F21V 19/0025 (2013.01); H01L 25/0753 (2013.01); H01L 33/505 (2013.01); F21Y 2113/13 (2016.08); F21Y 2115/10 (2016.08); H01L 2224/48091 (2013.01); H01L 2933/0041 (2013.01);
Abstract

An LED package structure with multiple color temperatures includes a substrate, a circuit layer disposed on the substrate, a plurality of first LED chips and a plurality of second LED chips disposed on the circuit layer, and a light conversion layer disposed on the substrate and the circuit layer. The light conversion layer has a spiral surface arranged away from the substrate. The light conversion layer includes a first light conversion portion and a second light conversion portion arranged around a lateral side of the first light conversion portion. The color temperature of the first light conversion portion is different from that of the second light conversion portion. The first LED chips are embedded in the first light conversion portion, and the second LED chips are embedded in the second light conversion portion. Thus, the LED package structure provided by the instant disclosure has good production efficiency.


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