The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Jan. 06, 2017
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Long Wang, Beijing, CN;

Yanzhao Li, Beijing, CN;

Chieh Hsing Chung, Beijing, CN;

Jie Sun, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 27/15 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0079 (2013.01); H01L 27/15 (2013.01); H01L 33/00 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A light-emitting diode substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of a light-emitting diode (LED) substrate, including: disposing a supporting substrate supporting a plurality of LED units to be opposed to a receiving substrate so that a side of the supporting substrate facing the receiving substrate supports the plurality of LED units; and irradiating a side of the supporting substrate away from the receiving substrate with laser, stripping the LED units from the supporting substrate, and transferring the LED units onto the receiving substrate. The manufacturing method of the LED substrate can better transfer LED units from the supporting substrate onto the receiving substrate.


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