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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10396180 B1

PDFFull Text
Date of Patent:
Aug. 27, 2019

Filed:

Aug. 25, 2016

Method for forming apparatus comprising two dimensional material

Applicant:

Emberion Oy, Espoo, FI;

Inventors:

Adam Robinson, Cambridge, GB;

Darryl Cotton, St. Ives, GB;

Alexander Bessonov, Cambridge, GB;

Richard White, Huntingdon, GB;

Yinglin Liu, Cambridge, GB;

Assignee:

EMBERION OY, Espoo, FI;

Attorney:

Squire Patton Boggs (US) LLP

Primary Examiner:

Caleb E Henry

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 31/028 (2006.01); H01L 31/0352 (2006.01); H01L 31/113 (2006.01); H01L 29/16 (2006.01); H01L 29/423 (2006.01); G01N 27/414 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66742 (2013.01); H01L 29/1606 (2013.01); H01L 29/42364 (2013.01); H01L 29/66045 (2013.01); H01L 29/778 (2013.01); H01L 31/028 (2013.01); H01L 31/035218 (2013.01); H01L 31/1136 (2013.01); G01N 27/4146 (2013.01); Y02E 10/547 (2013.01);
Abstract

A method and apparatus, the method comprising: forming at least two electrodes () on a release layer wherein the at least two electrodes are configured to enable a layer of two dimensional material () to be provided between the at least two electrodes; providing moldable polymer () overlaying the at least two electrodes; wherein the at least two electrodes and the moldable polymer form at least part of a planar surface ().

Find Patent Forward Citations

Robinson, Adam. (2019). Method for forming apparatus comprising two dimensional material (U.S. Patent No. 10396180). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10396180

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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