The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Jul. 26, 2018
Applicant:

Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);

Inventors:

Hamza Yilmaz, Saratoga, CA (US);

Xiaobin Wang, San Jose, CA (US);

Anup Bhalla, Santa Clara, CA (US);

John Chen, Palo Alto, CA (US);

Hong Chang, Cupertino, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 29/08 (2006.01); H01L 21/265 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/861 (2006.01); H01L 29/872 (2006.01); H01L 29/423 (2006.01); H01L 29/10 (2006.01); H01L 29/36 (2006.01); H01L 29/417 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0886 (2013.01); H01L 21/26586 (2013.01); H01L 27/0623 (2013.01); H01L 27/0629 (2013.01); H01L 27/0664 (2013.01); H01L 29/063 (2013.01); H01L 29/0615 (2013.01); H01L 29/0619 (2013.01); H01L 29/0634 (2013.01); H01L 29/0638 (2013.01); H01L 29/0676 (2013.01); H01L 29/0688 (2013.01); H01L 29/0696 (2013.01); H01L 29/0865 (2013.01); H01L 29/0882 (2013.01); H01L 29/1095 (2013.01); H01L 29/36 (2013.01); H01L 29/402 (2013.01); H01L 29/404 (2013.01); H01L 29/41741 (2013.01); H01L 29/41775 (2013.01); H01L 29/4236 (2013.01); H01L 29/66136 (2013.01); H01L 29/66143 (2013.01); H01L 29/66348 (2013.01); H01L 29/66734 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01); H01L 29/7803 (2013.01); H01L 29/7806 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01); H01L 29/7827 (2013.01); H01L 29/861 (2013.01); H01L 29/8613 (2013.01); H01L 29/872 (2013.01); H01L 29/8725 (2013.01); H01L 29/0649 (2013.01); H01L 29/0653 (2013.01); H01L 29/0692 (2013.01); H01L 29/0878 (2013.01); H01L 29/365 (2013.01); H01L 29/42368 (2013.01);
Abstract

Semiconductor devices are formed using a pair of thin epitaxial layers (nanotubes) of opposite conductivity type formed on sidewalls of dielectric-filled trenches. In one embodiment, a termination structure is formed in the termination area and includes a first termination cell formed in the termination area at an interface to the active area, the termination cell being formed in a mesa of the first semiconductor layer and having a first width; and an end termination cell being formed next to the first termination cell in the termination area, the end termination cell being formed in an end mesa of the first semiconductor layer and having a second width greater than the first width.


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