The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Apr. 24, 2018
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Shinnosuke Takahashi, Kyoto, JP;

Masayuki Aoike, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/423 (2006.01); H01L 29/40 (2006.01); H01L 29/778 (2006.01); H01L 29/66 (2006.01); H01L 21/76 (2006.01); H01L 21/762 (2006.01); H01L 29/47 (2006.01); H01L 29/205 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0619 (2013.01); H01L 21/76 (2013.01); H01L 21/76224 (2013.01); H01L 29/0626 (2013.01); H01L 29/1075 (2013.01); H01L 29/1083 (2013.01); H01L 29/405 (2013.01); H01L 29/42312 (2013.01); H01L 29/66431 (2013.01); H01L 29/66462 (2013.01); H01L 29/7781 (2013.01); H01L 29/7782 (2013.01); H01L 29/7783 (2013.01); H01L 29/7786 (2013.01); H01L 29/205 (2013.01); H01L 29/42316 (2013.01); H01L 29/475 (2013.01); H01L 29/778 (2013.01);
Abstract

A semiconductor layer arranged on a semiconductor substrate includes an active region and an element isolation region that surrounds the first active region when viewed in plan. A field effect transistor is formed in the active region. A plurality of guard ring electrodes separated from each other affect a potential of the active region through the element isolation region. An interlayer insulating film is formed over the semiconductor layer, the field effect transistor, and the guard ring electrodes. At least one guard ring connection wiring formed on the interlayer insulating film electrically interconnects the plurality of guard ring electrodes.


Find Patent Forward Citations

Loading…