The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Feb. 13, 2015
Applicant:

Nissan Arc, Ltd., Kanagawa, JP;

Inventor:

Satoshi Tanimoto, Kanagawa, JP;

Assignee:

NISSAN ARC, LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 24/40 (2013.01); H01L 24/49 (2013.01); H01L 25/18 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49431 (2013.01); H01L 2924/00014 (2013.01);
Abstract

A half-bridge power semiconductor module has an insulating wiring substrate including a single insulating plate, and a positive electrode wiring conductor, a bridge wiring conductor, and a negative electrode wiring conductor disposed on or above the insulating plate while being electrically isolated from one another, at least one high side power semiconductor device having a rear surface electrode bonded onto the positive electrode wiring conductor, at least one low side power semiconductor device having a rear surface electrode bonded onto the bridge wiring conductor, a stand-up bridge terminal connected to the bridge wiring conductor, a stand-up high side terminal disposed between the high side power semiconductor device and the bridge terminal, and connected to the positive electrode wiring conductor, and a stand-up low side terminal disposed between the bridge terminal and the low side power semiconductor device, and connected to the negative electrode wiring conductor.


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