The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Nov. 17, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Raymond Albert Fillion, Niskayuna, NY (US);

Kaustubh Ravindra Nagarkar, Clifton Park, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 24/20 (2013.01); H01L 23/50 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/19 (2013.01); H01L 24/13 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/211 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/20756 (2013.01); H01L 2924/20757 (2013.01); H01L 2924/20758 (2013.01); H01L 2924/37001 (2013.01);
Abstract

A reconfigured semiconductor logic device includes a semiconductor logic device comprising an active surface having a plurality of input/output (I/O) pads formed thereon and a redistribution layer. The redistribution layer includes an insulating layer disposed on the active surface of the semiconductor logic device and a patterned conductive layer comprising a plurality of discrete terminal pads formed atop the insulating layer. The plurality of discrete terminal pads are electrically coupled to respective I/O pads of the plurality of I/O pads by conductive vias formed through the insulating layer. The plurality of discrete terminal pads are larger than the plurality of I/O pads.


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