The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Sep. 22, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/367 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/13 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01); H01L 23/481 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 24/05 (2013.01); H01L 24/24 (2013.01); H01L 23/3677 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/19 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/18 (2013.01); H01L 2224/2401 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/24265 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/301 (2013.01); H01L 2924/3025 (2013.01);
Abstract
There is provided a fan-out semiconductor device in which a first package having a semiconductor chip disposed therein and having a fan-out form and a second package having a passive component disposed therein and having a fan-out form are stacked in a vertical direction so that the semiconductor chip and the passive component are electrically connected to each other by a path as short as possible.