The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Apr. 19, 2018
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Kei Fukui, Iizuna, JP;
Youichi Hoshikawa, Suzaka, JP;
Hiromitsu Kobayashi, Nagano, JP;
Hidehiko Fujisaki, Nagano, JP;
Seigo Yamawaki, Nagano, JP;
Masateru Koide, Kawasaki, JP;
Manabu Watanabe, Yokohama, JP;
Daisuke Mizutani, Sagamihara, JP;
Tomoyuki Akahoshi, Atsugi, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 28/40 (2013.01); H05K 1/162 (2013.01); H05K 3/4676 (2013.01); H05K 3/4632 (2013.01); H05K 3/4652 (2013.01);
Abstract
A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.