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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10396010 B1

PDFFull Text
Date of Patent:
Aug. 27, 2019

Filed:

Aug. 08, 2016

Onboard control device

Applicant:

Hitachi Automotive Systems, Ltd., Ibaraki, JP;

Inventors:

Kazuhiro Suzuki, Tokyo, JP;

Toshiaki Ishii, Tokyo, JP;

Yoshio Kawai, Hitachinaka, JP;

Yujiro Kaneko, Hitachinaka, JP;

Assignee:

HITACHI AUTOMOTIVE SYSTEMS, LTD., Ibaraki, JP;

Attorney:

Vople and Koenig, P.C.

Primary Examiner:

Robert J Hoffberg

Int. Cl.
CPC ...
H01L 23/367 (2006.01); B29C 45/14 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); B60R 16/02 (2006.01); H01L 23/28 (2006.01); H01L 23/36 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); B60R 16/023 (2006.01); H01L 21/56 (2006.01); H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); B29C 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); B29C 45/14836 (2013.01); B60R 16/02 (2013.01); B60R 16/0231 (2013.01); H01L 21/565 (2013.01); H01L 23/04 (2013.01); H01L 23/28 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/3736 (2013.01); H01L 24/32 (2013.01); H01L 25/07 (2013.01); H01L 25/165 (2013.01); H01L 25/18 (2013.01); H05K 1/0203 (2013.01); H05K 7/20 (2013.01); H05K 7/209 (2013.01); H05K 7/20454 (2013.01); H05K 7/20463 (2013.01); B29C 2045/0049 (2013.01); H01L 2224/32245 (2013.01);
Abstract

Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.

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