The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Mar. 17, 2016
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Sentaro Yamamoto, Kagoshima, JP;
Youji Furukubo, Kirishima, JP;
Masanori Okamoto, Kirishima, JP;
Yuhei Matsumoto, Kirishima, JP;
Assignee:
KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/08 (2006.01); H01L 21/48 (2006.01); H01L 23/057 (2006.01); H03H 9/17 (2006.01); H03H 9/10 (2006.01); H01L 23/053 (2006.01); H01L 41/053 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/4807 (2013.01); H01L 21/4817 (2013.01); H01L 23/053 (2013.01); H01L 23/057 (2013.01); H01L 23/08 (2013.01); H03H 9/10 (2013.01); H03H 9/17 (2013.01); H01L 41/053 (2013.01); H01L 2924/16315 (2013.01);
Abstract
The present invention includes: a substrate, a rectangular frame-shaped substrate bank sectionprovided on the substrateand including four corner portionsA, and a metal layerprovided on a top surfaceAa of the substrate bank section. A top surfaceAa of the corner portionsA of the substrate bank sectionmay have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layerprovided on the substrate bank sectionof the electronic component storage substrate.