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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10395953 B1

PDFFull Text
Date of Patent:
Aug. 27, 2019

Filed:

Aug. 11, 2015

Composite substrate for layered heaters

Applicant:

Watlow Electric Manufacturing Corporation, St. Louis, MO (US);

Inventors:

Jacob R. Lindley, St. Louis, MO (US);

Dean J. Meyer, Columbia, MO (US);

Alexander D. Glew, Mountain View, CA (US);

Assignee:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Attorney:

Burris Law, PLLC

Primary Examiner:

Dana Ross

Assistant Examiner:

James F Sims, III

Int. Cl.
CPC ...
H05B 3/00 (2006.01); H05B 3/12 (2006.01); H05B 3/06 (2006.01); H01L 21/67 (2006.01); H05B 3/14 (2006.01); H05B 3/28 (2006.01); H01C 17/06 (2006.01); H01L 21/683 (2006.01); H02N 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); H01C 17/06 (2013.01); H01L 21/6831 (2013.01); H02N 13/00 (2013.01); H05B 3/0014 (2013.01); H05B 3/06 (2013.01); H05B 3/12 (2013.01); H05B 3/14 (2013.01); H05B 3/28 (2013.01); H05B 2203/017 (2013.01); Y10T 29/49083 (2015.01);
Abstract

A heater assembly for use in semiconductor processing that includes an application substrate; a heater substrate secured to the application substrate by a thermal bonding process; and a functional layer disposed onto the heater substrate by a layered process. In this heater assembly, the heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer.

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Lindley, Jacob. (2019). Composite substrate for layered heaters (U.S. Patent No. 10395953). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10395953

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