The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Feb. 08, 2018
Applicant:

Toshiba Memory Corporation, Tokyo, JP;

Inventors:

Ryuichi Saito, Kawasaki Kanagawa, JP;

Seiji Morita, Tokyo, JP;

Ryosuke Yamamoto, Kawasaki Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01J 37/32 (2006.01); H01L 21/027 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32339 (2013.01); G03F 7/405 (2013.01); H01J 37/3244 (2013.01); H01L 21/0273 (2013.01); H01L 21/31144 (2013.01);
Abstract

In one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a substrate. The method further includes housing the substrate provided with the first film in a chamber, and introducing a first gas into the chamber. The method further includes generating plasma discharge of the first gas in the chamber or applying radiation to the first gas in the chamber. The method further includes introducing a second gas containing a metal component into the chamber to cause the metal component to infiltrate into the first film after the generation of the plasma discharge or the application of the radiation is started.


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