The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Sep. 27, 2013
Applicant:

Ntn Corporation, Osaka, JP;

Inventors:

Ikuo Uemoto, Mie, JP;

Shinji Miyazaki, Mie, JP;

Takuji Harano, Mie, JP;

Natsuhiko Mori, Mie, JP;

Hiroyuki Noda, Mie, JP;

Assignee:

NTN CORPORATION, Osaka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/255 (2006.01); H01F 1/22 (2006.01); H01F 41/02 (2006.01); H01F 1/26 (2006.01); H01F 3/08 (2006.01); B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); B22F 1/0062 (2013.01); H01F 1/22 (2013.01); H01F 1/26 (2013.01); H01F 3/08 (2013.01); H01F 41/0246 (2013.01); B22F 2998/10 (2013.01); C22C 2202/02 (2013.01);
Abstract

The present invention provides a magnetic core which can be produced with improved productivity without increasing a material cost and has required magnetic and mechanical properties and a process for producing the same. The magnetic core is produced by compression molding and thereafter thermally hardening iron-based soft magnetic powder having resin films formed on surfaces of particles thereof. The resin film is an uncured resin film formed by dry mixing the iron-based soft magnetic powder and epoxy resin containing a latent curing agent with each other at a temperature not less than a softening temperature of the epoxy resin and less than a thermal curing starting temperature thereof. The iron-based soft magnetic powder having the resin films formed on the surfaces of the particles thereof is compression molded by using a die to produce a compression molded body. The compression molded body having the resin films formed on the surfaces of the particles thereof is thermally hardened at a temperature not less than the thermal curing starting temperature of the epoxy resin.


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