The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Nov. 09, 2017
Applicant:

Fingerprint Cards Ab, Göteborg, SE;

Inventors:

Nils Lundberg, Höllviken, SE;

Zhimin Mo, Lund, SE;

Mats Slottner, Lerum, SE;

Assignee:

Fingerprint Cards AB, Göteborg, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06K 19/14 (2006.01); G06K 19/18 (2006.01); G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
G06K 19/145 (2013.01); G06K 9/0002 (2013.01); G06K 9/00053 (2013.01); G06K 19/0772 (2013.01); G06K 19/07701 (2013.01); G06K 19/18 (2013.01);
Abstract

There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry and a fingerprint sensor device cover structure, the cover structure having a first side configured to be touched by a finger, and a second side facing the sensing array, wherein the cover structure comprises conductive traces, arranged on the second side, for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.


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