The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Jun. 03, 2014
Applicant:

Gemalto SA, Meudon, FR;

Inventors:

Francis Allot, La Ciotat, FR;

Sophie Lombardo, La Ciotat, FR;

Mikko Lankinen, La Ciotat, FR;

Youssiph Kamagate, La Giotat, FR;

Frédéric Blachon, La Ciotat, FR;

Assignee:

GEMALTO SA, Meudon, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07728 (2013.01); G06K 19/077 (2013.01); G06K 19/0775 (2013.01); G06K 19/07747 (2013.01); G06K 19/07722 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/181 (2013.01);
Abstract

A method for making an intermediate electronic device, wherein said device is coated or is to be coated with a cover sheet or layer, the method comprising the step of forming a carrier-body comprising: a cavity provided in the carrier-body; an electric circuit comprising at least one electric interconnection area inside the cavity; an electronic module comprising at least one connection pad connecting said interconnection area and arranged in the cavity; a space or gap provided at the interface between the module and the carrier-body, substantially perpendicular to a main surface of the carrier-body, in communication with the surface of the carrier-body, and intended to be covered with a cover sheet or layer; the method is characterized in that a flexible or elastic material is arranged in the device so as to fill the space or gap between the module and the body-carrier or at least partially cover same.


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