The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Aug. 02, 2017
International Business Machines Corporation, Armonk, NY (US);
Michael A. Christo, Round Rock, TX (US);
David L. Green, Austin, TX (US);
Julio A. Maldonado, Austin, TX (US);
Diana D. Zurovetz, Round Rock, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Via array placement on a printed circuit board (PCB) outline including receiving, by a PCB design module, via array data from a user; generating, by the PCB design module, a via array based on the via array data from the user, including placing the via array on the PCB outline, wherein the via array comprises a grid of vias; detecting, by the PCB design module, that a first PCB element has been placed on top of a first portion of the via array on the PCB outline; removing, by the PCB design module, the first portion of the via array under the first PCB element, wherein a second portion of the via array remains on the PCB outline after removing the first portion of the via array; and generating, by the PCB design module, a PCB design document using the PCB outline and the second portion of the via array.