The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Jun. 11, 2018
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Jonathan F. Van Dyke, Baltimore, MD (US);

Martin B. Christiansen, Laurel, MD (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 39/22 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); H01L 39/223 (2013.01); H05K 7/20509 (2013.01);
Abstract

Computing systems including heat sinks (e.g., a first and a second heatsink) and metal preforms (e.g., a first and a second metal preform) are provided. The first metal preform is bonded to a portion of the first heat sink, where the first metal preform is configured to conform to the at least a portion of a superconducting component when the superconducting component is pressed against the first metal preform and hold shape even after a first pressure on the first metal preform is relieved. The computing system includes a second metal preform bonded to a portion of the second heat sink, where the second metal preform is configured to conform to the at least the portion of a superconducting component when the superconducting component is pressed against the second metal preform and hold shape even after a second pressure on the second metal preform is relieved.


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